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5-8°C Cooling Improvement
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Engineered for Kilowatt-scale Devices
5-8°C cooling benefit
on 1,000W+ devices
Boston Materials delivers improved cooling for kilowatt-scale devices, validated on previous-generation NVIDIA data center GPUs and test vehicles replicating Blackwell.
Data Center
Operators
A 5 to 8°C device-level cooling improvement enables more competitive application software performance and value, and the ability to deliver at greater energy efficiency.
Rack-Scale
Integrators
A 5 to 8°C device-level cooling improvement lowers energy consumption, reducing operational costs and improving Power Usage Effectiveness (PUE).
Thermal & Silicon
Designers
A 5 to 8°C device-level cooling improvement increases processor power and performance envelopes, while enabling simpler server and liquid cooling designs.
Unlock a New
Thermal Advantage
A New Class of Thermal InterfaceTM
Z-axis Carbon Fiber + Liquid Metal Composite, Exclusively from Boston Materials