Conventional Composites
Inefficient energy dissipation
ZRT® Liquid Metal Film TIM
Industry-leading thermal performance: <3 mm2-K/W thermal resistance at 150µm bond line thickness
Self-containment of liquid metal: Averts the cost of implementing complex dams in high-volume assembly and eliminates risk of leakage during operation
Accommodates die warpage: Up to 25% compliance in thickness, which facilitates die warpage, especially in larger-sized packages
Eliminates hot spots: Consistent and predictable surface coverage and high bulk thermal conductivity (100+ W/m-K)
Carbon fibers with 900 W/m-K thermal conductivity are vertically aligned using Boston Materials’ patented Z-axis Fiber™ technology and embedded within a liquid metal matrix (gallium-based).
The Z-axis aligned carbon fibers create a “honeycomb” structure that contains the liquid metal into a film, even at an elevated temperature.
ZRT® Liquid Metal Film is optimized for TIM1 and TIM1.5 applications in advanced microprocessors where very low thermal resistance, containment of the liquid metal, repeatable surface coverage, and high reliability are critical.
This product does NOT contain nanomaterials.
Download ZRT® Liquid Metal Film TIM Data Sheet
ZRT® Adhesive Film TIM
Competitive thermal performance: <10 mm2-K/W thermal resistance at 150µm bond line thickness
High reliability: High-strength pressure sensitive adhesive, with a rated operating temperature of 250°C+, creates a robust joint between the die and cooling device even if the load pressure relaxes
Eliminates hot spots: Consistent and predictable surface coverage and high thermal conductivity (40+ W/m-K)
Carbon fibers with 900 W/m-K thermal conductivity are vertically aligned using Boston Materials’ patented Z-axis Fiber™ technology and embedded within a pressure sensitive adhesive (solder reflow stable).
ZRT® Adhesive Film is optimized for TIM1 and TIM1.5 applications in advanced microprocessors where consistent thermal resistance, low implementation cost, and lifetime reliability are critical.
It aims to solve the delamination issues of graphite-based TIMs. Unlike traditional graphite-based TIMs, the adhesive in ZRT® Adhesive Film is evenly distributed throughout the entire thickness of the material, instead of only being applied at the surface.
This product does NOT contain nanomaterials.
Download ZRT® Adhesive Film TIM Data Sheet
Frequently Asked Questions
No – all products are thermally & electrically conductive.
ZRT® Liquid Metal Film TIM and ZRT® Adhesive Film TIM are specifically optimized for TIM1 and TIM1.5 applications in advanced microprocessors, including CPUs and GPUs.
ZRT® Liquid Metal Film TIM requires storage below 30°C. Boston Materials ships this product, both domestically and internationally, in cold packs. It is required by the recipient to ensure proper storage after receiving the package. The ZRT® Liquid Metal Film TIM should be handled using the provided plastic manipulator or pick-and-place equipment. Body heat can melt the film into a gummy state, making accurate application challenging. For avoidance of doubt, ZRT® Adhesive Film does not require cold storage.
Please submit an inquiry by selecting the “Get in Touch” button at the top right-hand side of this webpage. After submitting a request, an expert from Boston Materials will contact you directly to review your application and process the appropriate samples.
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Patented Z-axis Fiber™ Technology
Boston Materials uses vertically aligned carbon fiber to create materials with optimal energy transfer
properties – including thermal, electrical, and mechanical
properties – including thermal, electrical, and mechanical
Boston Materials Z-Axis Fiber™
Very efficient energy dissipation
Empowering Industries
with Z-axis Fiber™
Solving key problems relating to thermal management,
electrification, and lightweighting across high-growth industries
Semiconductors
Hot AI race needs cool chips
Electrified Vehicles
Journey to 100% electrification
Aerospace
Sky-high expectations for airplanes
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