Thermal interface material
POWERED BY Z-AXIS FIBER™

Thermal Interface Materials

Solving Efficiency Loss of Thermal Interfaces for Advanced Semiconductors

ZRT® Liquid Metal Film TIM

Industry-leading thermal performance: <3 mm2-K/W thermal resistance at 150µm bond line thickness

Self-containment of liquid metal: Averts the cost of implementing complex dams in high-volume assembly and eliminates risk of leakage during operation

Accommodates die warpage: Up to 25% compliance in thickness, which facilitates die warpage, especially in larger-sized packages

Eliminates hot spots: Consistent and predictable surface coverage and high bulk thermal conductivity (100+ W/m-K)

Carbon fibers with 900 W/m-K thermal conductivity are vertically aligned using Boston Materials’ patented Z-axis Fiber™ technology and embedded within a liquid metal matrix (gallium-based).

The Z-axis aligned carbon fibers create a “honeycomb” structure that contains the liquid metal into a film, even at an elevated temperature.

ZRT® Liquid Metal Film is optimized for TIM1 and TIM1.5 applications in advanced microprocessors where very low thermal resistance, containment of the liquid metal, repeatable surface coverage, and high reliability are critical.

This product does NOT contain nanomaterials.

Download ZRT® Liquid Metal Film TIM Data Sheet

ZRT Liquid Metal Film TIM

ZRT® Adhesive Film TIM

Competitive thermal performance: <10 mm2-K/W thermal resistance at 150µm bond line thickness

High reliability: High-strength pressure sensitive adhesive, with a rated operating temperature of 250°C+, creates a robust joint between the die and cooling device even if the load pressure relaxes

Eliminates hot spots: Consistent and predictable surface coverage and high thermal conductivity (40+ W/m-K)

Carbon fibers with 900 W/m-K thermal conductivity are vertically aligned using Boston Materials’ patented Z-axis Fiber™ technology and embedded within a pressure sensitive adhesive (solder reflow stable).

ZRT® Adhesive Film is optimized for TIM1 and TIM1.5 applications in advanced microprocessors where consistent thermal resistance, low implementation cost, and lifetime reliability are critical.

It aims to solve the delamination issues of graphite-based TIMs. Unlike traditional graphite-based TIMs, the adhesive in ZRT® Adhesive Film is evenly distributed throughout the entire thickness of the material, instead of only being applied at the surface.

This product does NOT contain nanomaterials.

Download ZRT® Adhesive Film TIM Data Sheet

ZRT Adhesive Film TIM

Boston Materials Thermal Pad

Boston Materials Thermal Pad is specially formulated for thermal interface applications in power electronics.

Typical applications include mounting IGBT modules, high-power RF boards, and laser modules to heatsinks and cold plates.

This product is a suitable replacement for traditional graphite thermal pads.

The Boston Materials Thermal Pad has a built-in adhesive that can secure components that are prone to failure due to high thermal cycling, shock and vibration, and other intensive environmental conditions.

This product does NOT contain nanomaterials.

Boston Materials Thermal Pad

Frequently Asked Questions

No – all products are thermally & electrically conductive.

ZRT® Liquid Metal Film TIM and ZRT® Adhesive Film TIM are specifically optimized for TIM1 and TIM1.5 applications in advanced microprocessors, including CPUs and GPUs.

Boston Materials Thermal Pad is specifically optimized for power electronics cooling. Considering the size requirements and increased exposure to environmental conditions, the ZRT® TIM product line is not recommended.

ZRT® Liquid Metal Film TIM requires storage below 30°C. Boston Materials ships this product, both domestically and internationally, in cold packs. It is required by the recipient to ensure proper storage after receiving the package. The ZRT® Liquid Metal Film TIM should be handled using the provided plastic manipulator or pick-and-place equipment. Body heat can melt the film into a gummy state, making accurate application challenging. For avoidance of doubt, ZRT® Adhesive Film does not require cold storage.

Please submit an inquiry by selecting the “Get in Touch” button at the top right-hand side of this webpage. After submitting a request, an expert from Boston Materials will contact you directly to review your application and process the appropriate samples.

Boston Materials will soon be launching a ZRT® TIM e-shop to purchase units that have been optimized to the latest GPU and CPU products.

Haven’t Found What You Are Looking For?

Patented Z-axis Fiber Technology

Boston Materials uses vertically aligned carbon fiber to create materials with optimal energy transfer
properties – including thermal, electrical, and mechanical 

Conventional Composites

Inefficient energy dissipation

Boston Materials Z-Axis Fiber™

Very efficient energy dissipation

Empowering Industries
with Z-axis Fiber™

Solving key problems relating to thermal management,
electrification, and lightweighting across high-growth industries

Semiconductors
Electrified vehicles
Aerospace
Semiconductors
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Semiconductors

Hot AI race needs cool chips

Electrified vehicles
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Electrified Vehicles

Journey to 100% electrification

Aerospace
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Aerospace

Sky-high expectations for airplanes

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