Thermal Interface
Materials
Solves the performance and reliability issues of advanced semiconductors for computing, telecom, and power applications
Advanced Semiconductors & Datacenters
Electronics Thermal Management
The impact of thermal interface materials (TIMs) to semiconductor cooling performance was 10%. That has now skyrocketed to 40% to 50%. TIMs are now a critical chokepoint for advanced semiconductors used across datacenters, mobile electronics, autonomous vehicles and beyond.
Lightweight Aerostructures
Carbon Fiber Composites
The next generation of aircraft with improved range and efficiency will need to be lighter. Yet, the usage of lightweight carbon fiber composites has plateaued. Delamination is the culprit and solving it can unlock the next 10% of airframe weight reduction.
Heavy-Duty Vehicle Decarbonization
PEM Fuel Cells
Hydrogen fuel cells present a promising technology for decarbonizing trucks without compromising on range or payload capacity. However, their durability remains a significant challenge, due to metal contamination from the degradation of metallic bipolar plates. Addressing this issue is crucial for their broader application in the trucking industry.
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