8-10°C Cooling
Advantage
Solving the thermal-mechanical chokepoints of multi-kilowatt-scale devices with large die arrays and complex warpage
AI and HPC Semiconductors Have
Outpaced Traditional Material Limits.
We deliver the high-performance
thermal interfaces
that are necessary to unlock semiconductor scaling.
By solving critical vulnerabilities in thermal management & semiconductor packaging, we turn performance deficiencies and supply chain risks into a competitive advantage for businesses with aggressive product roadmaps.
8-10°C Cooling
Built for Data Center
Reliability
Extensively tested across aggressive environments: high temperature, high humidity, power cycling, and thermal shock
ISO 9001 Certified
Facilities
ISO 9001 certified operations established in Massachusetts, USA with HVM-ready process technologies, QMS, and clean room facilities
Unlock a New
Thermal Advantage
Strategic Partnership
Global Supply Chain
Partnership with
Mitsubishi Chemical
The collaboration pairs Mitsubishi Chemical Group’s standing as a premier semiconductor materials supplier with Boston Materials’ capacity to scale globally for mass deployment.
The Era of Thermal-Mechanical InterfacesTM
Patented Carbon Fiber-Liquid Metal Technology.
Many TIM (Thermal Interface Material) technologies fail to translate into a real-world thermal advantage. They solely focus on heat transfer and ignore the mechanical challenges.
Boston Materials accounts for the thermal-mechanical reality of next-gen AI & HPC silicon—managing kilowatt-scale heat transfer in devices with complex warpage from CTE (Coefficient of Thermal Expansion) mismatch and stringent reliability standards.