Delivering an 8-10°C
Cooling Advantage
Solving the thermal-mechanical chokepoints of multi-kilowatt-scale devices with large die arrays and complex warpage
Welcome to the Era of TMI
AI and HPC Semiconductors Have
Outpaced Traditional Material Limits.
We deliver the high-performance
Thermal-Mechanical Interfaces (TMIs)
necessary to unlock semiconductor scaling.
By solving critical vulnerabilities in thermal management & semiconductor packaging,
we turn performance deficiencies and supply chain risks into a competitive advantage
for businesses with aggressive product roadmaps.
we turn performance deficiencies and supply chain risks into a competitive advantage
for businesses with aggressive product roadmaps.
Delivering an 8-10°C
Exceeds Data Center
Reliability Specs
Extensively tested across aggressive environments: high temperature, high humidity, power cycling, and thermal shock
ISO 9001 Certified
Facilities
ISO 9001 certified operations established in Massachusetts, USA with HVM-ready process technologies, QMS, and clean room facilities
Unlock a New
Thermal Advantage
Strategic Partnership
Global Supply Chain
Partnership with
Mitsubishi Chemical
The collaboration pairs Mitsubishi Chemical Group’s standing as a premier semiconductor materials supplier with Boston Materials’ capacity to scale globally for mass deployment.
Welcome to the Era of TMI:
Thermal-Mechanical InterfacesTM
Purpose-built for the thermal demands of next-generation AI and HPC semiconductors
with Boston Materials patented Carbon Fiber-Liquid Metal Technology.
While a standard TIM (Thermal Interface Material) focuses solely on heat transfer, our TMI (Thermal-Mechanical Interface) accounts for the mechanical reality of your hardware—managing CTE (Coefficient of Thermal Expansion) mismatch and vibration to ensure your thermal path never breaks.