01
Delivering an 8-10°C
02
Readily Integrates Into
Pick-and-Place Assembly
03
Exceeds Data Center
Reliability Specs
Drastic cooling advantage
Highest performance thermal interface material when heat generation continues out to the edge of die array (distributed hot spots, HBM, I/O, CPO)
Pick-and-placeable preform drops into automated assembly lines
Liquid metal is retained by carbon fiber, remains solid during assembly
Turnkey integration without any changes to silicon
No backside metallization or surface treatment is needed on the silicon
Purpose-built for high power devices with large die array warpage
Less than 5 mm2-K/W thermal resistance at 150µm bond line thickness
Ready for wafer-scale compute
Max preform size of 200x200mm, roadmap to larger size
Liquid Metal ZRT® is a Carbon Fiber–Liquid Metal thermal interface purpose-built for the thermal demands of next-generation AI and HPC semiconductors.
As chip TDPs push past 2kW, conventional thermal interfaces have become a critical chokepoint. This product eliminates that constraint, and customers have validated it as the highest-performing solution available for these workloads.
Unlike dispensed liquid metals, it is delivered as a solid sheet that melts after installation, enabling seamless integration through standard pick-and-place automation, already validated by leading ODM server assemblers.
Request ZRT® Liquid Metal Film TIM Data Sheet
Thermal-Mechanical InterfacesTM
Carbon Fiber-Liquid Metal Thermal Interface,
Produced with Boston Materials Patented Technology
Produced with Boston Materials Patented Technology
Carbon Fiber-Liquid Metal Composite
Patented Z-axis Carbon Fiber Microstructure
Effectively Cool
“Monster” Chips with
Liquid Metal ZRT®
Delivering 8-10°C Cooling Advantage to Multi-Kilowatt-Scale
Devices with Large Die Arrays and Complex Warpage
Devices with Large Die Arrays and Complex Warpage
Maximize
Liquid Cooling with
Liquid Metal ZRT®
Extend the Performance Envelope of Direct-to-Chip
Liquid Cooling for Multi-Kilowatt-Scale Devices
Liquid Cooling for Multi-Kilowatt-Scale Devices
Ensure Long-Term
Performance with
Liquid Metal ZRT®
Eliminate the Assembly and Reliability Chokepoints
of Dispensed Liquid Metals
of Dispensed Liquid Metals
